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CoolSem’s patented wafer-level thermal management technology helps chips run cooler, last longer, and perform beyond today’s limits. While traditional cooling techniques remove heat from the package or system level, the real challenge lies deeper in the thermal resistance of the chip’s substrate. But the challenge goes deeper than heat itself. As devices cycle through temperature changes, the different materials inside each chip expand and contract at different rates, adding mechanical stress on top of thermal resistance. Over time, this stress degrades interfaces and compounds the very heat problem it’s meant to control. CoolSem removes the substrate, the barrier to efficient heat flow. We replace it with our patented wafer-level carrier that conducts heat up to 15× better. Our patented WaLTIS® wafer-level technology reduces thermal resistance by up to 15× and eliminates hotspots that degrade device performance and reliability. At the same time, the architecture remains dielectrically neutral, fully compatible with existing device layouts and electrical isolation schemes. Do you want to know more? Visit our website or contact us by sending us a message via LinkedIn or info@coolsemtechnologies.com.